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Microelectronics Show 2011 is the most outstanding event for electronics packaging industry, in Japan. The event will feature a vast range of products and services related to electronics packaging industry, as well as, provide opportunity for manufacturers and suppliers to promote their brands and build corporate image for their products. The 25th Advanced Electronics Packaging Exhibition will highlight leading-edge products based on futuristic high-density, components contained boards, semiconductor chips, sealing resins, anti-heat materials, COB Systems and Production Facilities, etc. It will provide a unique chance for the attendees to explore the latest developments and technical innovations across the entire electronics packaging spectrum. 2011 Microelectronics Show will offer a superb opportunity for industry professionals to gain insights into new direction, learn about newest technologies, network and interact face-to-face with the leading industry players.
Visitor Profile
The targeted visitors at Microelectronics Show 2011 are:
- Researchers
- Academicians
- Managers
- Technologists
- Technical Companies
- Electronics Company
- Technical Experts
- Microelectronics Technology Companies
- Industry Professionals
- Engineers
- Media
Exhibitor Profile
The profile for exhibits at 2011 Microelectronics Show includes:
- Leading-Edge Products Based on Futuristic High-Density
- High-Density Substrates and Interposers
- Component Contained Boards
- Semiconductor Chips
- Systems in Package (SIP)
- Systems on Chip (SOC)
- Indication/Optical Devices and Sensors
- Materials related to High-Density Packaging
- Sealing Resins
- Anti-Heat Materials
- High Frequency Ready Polymer
- Systems and Devices related to High-Density Packaging
- COB Systems and Production Facilities
Organizer
Japan Electronics Packaging and Circuits Association
