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The 13th IC Packaging Technology Expo 2012 is an exhibition specialized in IC Final Manufacturing. The exhibition includes sessions on materials, manufacturing and testing services. The participants will get a chance to interact with the experts and professionals from across the world. The show also exhibits the latest products and services in the exhibition. Visitors will have an opportunity to explore the latest assembly equipment, packaging materials, inspection equipment, semiconduct devices and other related services. The 13th IC Packaging Technology Expo 2012 includes sub contractor zone, which features top companies in IC design and testing services.
Visitor Profile
The targeted attendees at the 13th IC Packaging Technology Expo 2012 are as follows:
- Professionals
- Engineers
- Architects
- Designs
- Professionals of Quality Control
- Media
- IT Companies
- Manufacturers
- Suppliers
Exhibitor Profile
The exhibitors' profiles at the 13th IC Packaging Technology Expo 2012 are as follows:
- Testers
- Components
- Industrial Journals
- Assembly Services
- Assembly Equipment
- Measurement Packaging Materials
- Inspection Equipment
- Related Services
- Semiconductor Packaging Analysis Software
- Other IC Packaging Technology Information
- Other Packaging Technology Packaging Sourcing
Organizer
Reed Exhibitions Japan Ltd.
